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Patent Searching and Data


Title:
POLISHING DEVICE
Document Type and Number:
Japanese Patent JPS6119559
Kind Code:
A
Abstract:

PURPOSE: To hold the abrasive grain concentration of substantially acting abrasive fluid to a fixed condition and perform high accurate polishing, by providing a plate-shaped blade of soft material of rubber or the like in the peripheral part of a polishing tool and removing unnecessary abrasive fluid and dust or the like by this blade.

CONSTITUTION: A polishing device, rotating a tool mounting shaft 1 while supplying abrasive fluid of fixed concentration and quantity into a supply hole 1a of abrasive fluid, pollshes a material 11 to be polished by pressing a polishing cloth 9 to the material. Here the device, removing unnecessary abrasive fluid and dust or the like existing in the peripheral side of the polishing cloth 9 by a blade 13 rotating with a joint 12 made of rubber, holds an abrasive grain condition of the substantially acting abrasive fluid to a fixed level. While a polished surface is not flawed by the blade 13 due to its rubber quality, further a polishing tool is prevented also from its uneven contact because the rubber made joint 12 provides flexibility. Accordingly, the polishing device enables the polished surface to be high accurately polished without causing a flaw and unsymmetry.


Inventors:
KAWAI TSUNEO
Application Number:
JP13901784A
Publication Date:
January 28, 1986
Filing Date:
July 06, 1984
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
B24B37/00; B24B53/017; B24B57/02; (IPC1-7): B24B37/04; B24B57/02
Attorney, Agent or Firm:
Akio Takahashi