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Patent Searching and Data


Title:
POLISHING METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0310750
Kind Code:
A
Abstract:

PURPOSE: To sharply reduce a man-hour and a time required for production of a sample by a method wherein after the one surface of a semiconductor device is secured on the flat surface of a rotary type sample holder, the other surface is brought into contact with the polishing surface of a rotary table.

CONSTITUTION: The one surface of a semiconductor device 1 is secured on the flat surface of a rotary type sample holder 3 by using a double-coated tape. The other surface of the semiconductor device 1 secured to the holder 3 is brought into contact with a rotary type polishing table 4, and with this state, the two members are rotated in the directions of arrow marks reverse to each other to apply a polishing work on the other surface of the semiconductor device 1.


Inventors:
SATO MITSUO
Application Number:
JP14640789A
Publication Date:
January 18, 1991
Filing Date:
June 07, 1989
Export Citation:
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Assignee:
NEC YAMAGATA LTD
International Classes:
B24B7/04; B24B37/27; B24B37/28; H01L21/304; (IPC1-7): B24B7/04; B24B37/04; H01L21/304