Title:
POLYAMIDE ADHESION IMPROVER, AND MULTI-LAYER COMPOSITE AND MULTI-LAYER PIPE THEREWITH
Document Type and Number:
Japanese Patent JPH09194815
Kind Code:
A
Abstract:
To provide a polyamide adhesion improver to firmly joint a thermoplastically processable fluoropolymer, esp. that based on TFE, HFP, and VDF, and polyamides, and also provide a multi-layer composite, esp. a multi-layer pipe, using the material.
This polyamides adhesion improver has an amino terminal group to carboxyl terminal; group ratio of 1.5:1-3:1 and after polymerization, 0.25-2wt.% of at least one diamine selected from the group consisting of a 4-20C saturated or unsaturated aliphatic diamine and a mixture thereof is added.
Inventors:
GEORUGU SHIYUTETSUPERUMAN
Application Number:
JP26327296A
Publication Date:
July 29, 1997
Filing Date:
October 03, 1996
Export Citation:
Assignee:
INVENTA AG
International Classes:
B29D22/00; B32B27/08; B32B27/34; B32B27/30; C08G69/14; C08G69/16; C08G69/26; C08G69/28; C08L77/00; C09J177/00; (IPC1-7): C09J177/00; B32B27/30; B32B27/34
Attorney, Agent or Firm:
Etsushi Kotani (2 outside)
Previous Patent: MOISTURE-CROSSLINKABLE HOT-MELT ADHESIVE AND PREPARATION THEREOF
Next Patent: HEAT TRANSFER MEDIUM AND CIRCULATING SYSTEM THEREOF
Next Patent: HEAT TRANSFER MEDIUM AND CIRCULATING SYSTEM THEREOF