Title:
POLYAMIDE RESIN COMPOSITION FOR BEING BONDED TO METAL AND METHOD FOR PRODUCING THE SAME, AND HETEROGENEOUS COMPOSITE MOLDING COMPOSED OF MOLDING INCLUDING THE POLYAMIDE RESIN COMPOSITION AND METAL
Document Type and Number:
Japanese Patent JP2021066877
Kind Code:
A
Abstract:
To provide a polyamide resin composition for being bonded to a metal, allowing for formation of a molding which has high bonding strength to metal compared to a conventional molding including a thermoplastic resin, the high bonding strength being unlikely to decrease even in a harsh environment of high temperature and high humidity, and is also excellent in airtightness at a bonding interface to a metal.SOLUTION: A polyamide resin composition for being bonded to a metal, having a sintered layer or a fusion layer of metallic powder formed on at least a part of a surface by laser irradiation contains 0.1-50 pts.mass of a cellulose fiber (B) having an average fiber diameter of 10 μm or less with respect to 100 pts.mass of a polyamide resin (A).SELECTED DRAWING: None
Inventors:
NOGUCHI SHOTA
NAKAI YOSHIO
TOMORI TAKESHI
REN KOICHI
NAKAI YOSHIO
TOMORI TAKESHI
REN KOICHI
Application Number:
JP2020174839A
Publication Date:
April 30, 2021
Filing Date:
October 16, 2020
Export Citation:
Assignee:
UNITIKA LTD
International Classes:
C08L77/00; C08K3/013; C08L1/02
Attorney, Agent or Firm:
Norihito Yamao
Kitahara Yasuhiro
Kitahara Yasuhiro