Title:
ポリアミド樹脂組成物およびそれを用いた成形品
Document Type and Number:
Japanese Patent JP6844314
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polyamide resin composition which is excellent in thermal conductivity, cold and heat resistance, and measuring stability during injection molding and is capable of giving a molded article excellent in balance between moldability and mechanical strength.SOLUTION: The polyamide resin composition contains (A) 25-60 wt.% of a polyamide resin and (B) 40-75 wt.% of a non-fibrous inorganic filler selected from magnesium hydroxide, magnesium carbonate, talc, and mixtures thereof, based on 100 wt.% of the total of (A) and (B) and satisfies the following [I] and [II]: [I] the polyamide resin (A) contains 0.05-20 wt.% of a polyalkylene glycol structure; and [II] the thermal conductivity of the polyamide resin composition measured by a heat flow meter method is 0.8 W/m K or more.SELECTED DRAWING: None
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Inventors:
Takuro Okubo
Hideyuki Umezu
Hideyuki Umezu
Application Number:
JP2017036505A
Publication Date:
March 17, 2021
Filing Date:
February 28, 2017
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
C08L77/00; C08G69/40; C08K3/22; C08K3/26; C08K3/34; C08K7/04
Domestic Patent References:
| JP2016056261A | ||||
| JP2014037467A |
Foreign References:
| WO2015182693A1 |
Attorney, Agent or Firm:
Toshimitsu Ban
Koichi Hosoda
Koichi Hosoda