To obtain microparticles being flexible and excellent in connection resistance and connection reliability by specifying their compressive modulus and their percentage recovery from compressive deformation.

Polymer microparticles are provided which have a compressive modulus (10% K value) of 10-50 kgf/mm2 and a percentage recovery from compression of at least 30% (as measured on microparticles whose diameters have had a 10% displacement), a mean particle diameter of 0.1-500 μm, and a Cv value of at most 25% [where Cv(%)=(standard deviation of particle diameters/ mean particle diameter)×100%]. These microparticles can be obtained by forming a conductive layer comprising e.g. nickel, gold, silver, copper, cobalt, tin, indium, ITO, or an alloy based thereon on the surface of each of the polymer microparticles obtained by effecting the suspension polymerization or seed polymerization of a crosslinking monomer such as 1,6-hexanediol (meth)acrylate and a copolymerizable unsaturated monomer such as styrene in the presence of 0.1-15 pts.wt., per 100 pts.wt. polymerizable monomer, radical polymerization initiator and, optionally, a surfactant and 0.01-20 pts.wt. dispersion stabilizer.