Title:
POLYMER, PHOTOSENSITIVE RESIN COMPOSITION AND ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2014136718
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polymer for improving operational reliability of an electronic device, a photosensitive resin composition, and an electronic device.SOLUTION: The polymer comprises a copolymer expressed by formula (1) described below, which has a molecular weight distribution curve obtained by GPC in which a peak area in a molecular weight range up to 1000 is 1% or less of the whole area. In formula (1), A represents a structural unit derived from maleic acid anhydride.
Inventors:
IKEDA TAKAO
TAGASHIRA NOBUO
IMAMURA YUJI
ONISHI OSAMU
TAGASHIRA NOBUO
IMAMURA YUJI
ONISHI OSAMU
Application Number:
JP2013004981A
Publication Date:
July 28, 2014
Filing Date:
January 15, 2013
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08F232/08; G03F7/023; G03F7/038; H01L21/027
Domestic Patent References:
| JP2001272785A | 2001-10-05 |
Foreign References:
| WO2012071496A1 | 2012-05-31 |
Attorney, Agent or Firm:
Shinji Hayami