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Patent Searching and Data


Title:
POLYPROPYLENE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2001081254
Kind Code:
A
Abstract:

To obtain a polypropylene resin composition which is excellent in mechanical performance and rigidity under heating and is almost free from flow marks, or the like, by incorporating a polypropylene resin having specified wt. average mol.wt. and mo.wt. distribution with mica having specified particle size and shape into the same.

This composition contains at least 30 wt.% polypropylene resin (A) having a wt. average mol.wt. of 100,000-500,000 and a ratio (Mw/Mn) of wt. average mol.wt. (Mw) to number average mol.wt. (Mn) of 8-15 and 10-50 wt.% mica (B) having at wt. average particle size of 10-500 μm and a wt. average aspect ratio of 100 or higher. Preferably, the composition further contains at least 0.1 wt.% polypropylene resin (C) modified with at least one compound selected from among unsaturated carboxylic acids, acid anhydrides, organosilane compounds, and derivatives of these compounds. Ingredient A is preferably an isotatic homopolypropylene. Ingredient C having an MFR of 100-250 g/10 min is especially preferable.


Inventors:
TAEDA SEIICHI
SHIMA TOSHIAKI
Application Number:
JP26185099A
Publication Date:
March 27, 2001
Filing Date:
September 16, 1999
Export Citation:
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Assignee:
KURARAY CO
International Classes:
C08J5/00; B29C45/00; C08K3/34; C08L23/10; B29K23/00; (IPC1-7): C08L23/10; B29C45/00; C08K3/34