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Title:
POLYSILOXANE RESIN COMPOSITION, DISPLAY DEVICE AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2014065864
Kind Code:
A
Abstract:

To provide a polysiloxane resin composition that gives a smooth coating film and is particularly suitable for forming an insulating film, a protective film or a flattening film on a TFT element or a semiconductor element, and to provide a display device and a semiconductor device using the composition.

The polysiloxane resin composition comprises a polysiloxane resin (A), an organic solvent (B), and a fluorine-based surfactant (C). The surfactant (C) having a fluorine atom is a block copolymer including a polymerization segment (M1) comprising a polymerizable monomer (m1) having a fluorinated alkyl group having 1 to 6 carbon atoms and an ethylenic double bond, and a polymerization segment (M2) of monomers including a polymerizable monomer (m2) having an alkylene oxy group and an ethylenic double bond. The display device has a cured film formed by using the above composition on a TFT element. The semiconductor device includes a cured film formed by using the composition on a semiconductor element.


Inventors:
OZAKI YUSUKE
TAKANO HIROSHI
Application Number:
JP2012213906A
Publication Date:
April 17, 2014
Filing Date:
September 27, 2012
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
C08L83/04; C08F297/00; C08G77/20; C09D7/12; C09D183/04; H01L21/312
Domestic Patent References:
JP2011089080A2011-05-06
JP2009302087A2009-12-24
JP2010013513A2010-01-21
JP2012062433A2012-03-29
JP2008297522A2008-12-11
JP2004334107A2004-11-25
Attorney, Agent or Firm:
河野 通洋