To provide a method for adjusting the position of an object with high precision.

At steps 103-117, a wafer W is aligned with a wafer stage WST. At step 119, the wafer W is loaded to the wafer stage WST where search alignment is performed and residual rotary amount of the wafer W for the wafer stage WST is calculated. At step 125, a decision is made whether the residual rotary amount falls within an allowable range or not and if it deviates from the allowable range, the wafer is collected at step 127 and the steps 103-125 are repeated until decision at step 125 is affirmed. When rotation of the wafer W is adjusted, rotation of the wafer W detected by search alignment is taken into account.