Title:
粉体の充填方法および充填装置
Document Type and Number:
Japanese Patent JP7104409
Kind Code:
B2
Abstract:
To provide a powder filling method and a powder filling device capable of increasing filling density and improving homogeneity.SOLUTION: A device pours powder into the inside of a cylindrical rubber die 1 having a bottom part 1b from the upper part of the rubber die 1 for filling. The device has: a lower plug 12 that is provided on the bottom part 1b so that it protrudes toward the inside of the rubber die 1 and does not come ouf of the bottom part 1b, and is harder than the rubber die 1; a pedestal 2 with the rubber die 1 placed thereon in a standing state; a relay pin 21 passing through the pedestal 2 so as to be vertically movable and further having an upper edge part butted to the lower plug 12; and impact means 3 for applying the impact force of pushing up the relay pin 21 to the side of the lower plug 12 to the relay pin 21.SELECTED DRAWING: Figure 1
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Inventors:
Toshio Yoshioka
Hiroshi Yoshioka
Hiroshi Yoshioka
Application Number:
JP2018191467A
Publication Date:
July 21, 2022
Filing Date:
October 10, 2018
Export Citation:
Assignee:
Sanwa System Engineering Co., Ltd.
International Classes:
B28B3/00; B22F3/02; B22F3/087; B28B3/02; B28B13/02; B65B1/22
Domestic Patent References:
JP3097803A | ||||
JP7024824A | ||||
JP2008038160A | ||||
JP3124402A | ||||
JP2005279708A |
Attorney, Agent or Firm:
Watanabe
Kikuhiko Nakamoto
Kikuhiko Nakamoto