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Title:
PREPARATION METHOD OF RESIN MOLDING FOR VIBRATION INSULATION AND RESIN MOLDING FOR VIBRATION INSULATION OBTAINED BY THE METHOD, AND VIBRATION INSULATION APPARATUS USING THE SAME
Document Type and Number:
Japanese Patent JP2014065269
Kind Code:
A
Abstract:

To provide a preparation method that can obtain a resin molding for vibration insulation that is light-weight and excellent in mechanical strength more simply or at lower costs; a resin molding for vibration insulation that can be obtained by the method; and a vibration insulation apparatus using the resin molding for vibration insulation.

Provided is a vibration insulation apparatus that includes an elastic member 1 and a resin bracket 2 to journal the same, and in which first and second coupling parts 3, 4 to connect the same between two members to be objects for vibration insulation are disposed, and in the vibration insulation apparatus, at least one of the coupling parts 3, 4 is formed by a resin molding for vibration insulation that is obtained by a special injection molding method and is excellent in mechanical strength.


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Inventors:
SUZUKI JUNICHIRO
NAKANO MASAYOSHI
KATAYAMA KAZUTAKA
MIZUTANI KOJI
Application Number:
JP2012213789A
Publication Date:
April 17, 2014
Filing Date:
September 27, 2012
Export Citation:
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Assignee:
TOKAI RUBBER IND LTD
International Classes:
B29C45/00; F16F15/04
Domestic Patent References:
JP2005188182A2005-07-14
JP2001260171A2001-09-25
JPH02292009A1990-12-03
JPH03287666A1991-12-18
JP2011201296A2011-10-13
Attorney, Agent or Firm:
Masahiko Nishito



 
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