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Title:
PRESSURE-SENSITIVE ADHESIVE SHEET, PRODUCTION METHOD THEREOF AND METHOD OF PROCESSING ARTICLE
Document Type and Number:
Japanese Patent JP2007084722
Kind Code:
A
Abstract:

To provide a pressure-sensitive adhesive sheet that is used in processing article such as a semiconductor wafer that causes neither contamination nor breakage of the semiconductor wafer during the processing.

The pressure-sensitive adhesive sheet comprises a base material, an intermediate layer, and a pressure-sensitive adhesive layer in this order, in which the intermediate layer includes a composite film containing a urethane polymer and a vinyl-based polymer as active ingredients and the urethane polymer contains a component having a weight-average molecular weight of ≤10,000 in a differential molecular weight curve in a content of less than 10%.


Inventors:
KONYA TOMOHIRO
AKAZAWA MITSUHARU
YANO KOHEI
YOSHIDA YOSHITOKU
Application Number:
JP2005000276369
Publication Date:
April 05, 2007
Filing Date:
September 22, 2005
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
C09J7/02; H01L21/683; H01L21/301; H01L21/304
Domestic Patent References:
JP2004331743A2004-11-25
JP2004106515A2004-04-08
JP2004107644A2004-04-08
JP2004122758A2004-04-22
JP2001203255A2001-07-27
JP2005019666A2005-01-20
Attorney, Agent or Firm:
Yumiko Oshima