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Title:
PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2020040174
Kind Code:
A
Abstract:
To provide a processing device equipped with a support mechanism for supporting a work-piece, which can be applied to the work-piece requiring high accuracy and yet can promptly deal with the work-piece even if a diameter of the work-piece is changed.SOLUTION: A processing device 10 is equipped with a chuck for holding a work-piece 7, a rotating mechanism that rotates the work-piece 7, a support mechanism having a plurality of support parts 17 that can be brought into contact with a plurality of places on an outer peripheral surface of the work-piece 7 from outside in a radial direction, and a tool. Each of the support parts 17 has: a plunger 23 having a ball 21 held rotatably provided at a tip part thereof; a hydraulic unit 30 that imparts thrust to the plunger 23 in order to be brought into contact with the ball 21, arranged at a retreat position separated from the outer peripheral surface 8 of the work-piece 7, with the outer peripheral surface 8; a spring 26 that is brought into contact with the ball 21 with the outer peripheral surface 8 of the work-piece 7 by elastic pressing force; and a collet 24 that disenables movement of the plunger 23 when the ball 21 is brought into contact with the outer peripheral surface 8.SELECTED DRAWING: Figure 3

Inventors:
YOKOYAMA TAKASHI
NISHIDA TATSUYA
KUROYANAGI SHOGO
SHICHIRI YOSHINOBU
Application Number:
JP2018169788A
Publication Date:
March 19, 2020
Filing Date:
September 11, 2018
Export Citation:
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Assignee:
JTEKT CORP
International Classes:
B23Q1/76; B23B1/00; B23B27/08; B24B5/18; B24B55/00
Attorney, Agent or Firm:
Sancrest International Patent Office



 
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