Title:
半導体ウェーハの加工装置
Document Type and Number:
Japanese Patent JP4186152
Kind Code:
B2
Inventors:
Nobuyuki Hayashi
Application Number:
JP2001082065A
Publication Date:
November 26, 2008
Filing Date:
March 22, 2001
Export Citation:
Assignee:
Sumco inc.
International Classes:
H01L21/304; B24B37/015; B24B37/12; B24B37/16
Domestic Patent References:
| JP10080861A | ||||
| JP6246624A | ||||
| JP9174418A | ||||
| JP9262747A |
Attorney, Agent or Firm:
Ichiro Abe