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Patent Searching and Data


Title:
PROCESSING METHOD AND HOLE DRILLING SYSTEM
Document Type and Number:
Japanese Patent JP2019166625
Kind Code:
A
Abstract:
To provide a processing method for performing hole drilling efficiently to a workpiece.SOLUTION: A processing method for penetration small-diameter hole processing having a high aspect ratio for an SiC shower plate is a hybrid hole processing method formed by combining a step S102 for forming a through hole by irradiating laser 21 from a laser irradiation part 22, a through hole position measurement step S104 by a through hole position acquisition camera 32, and a wet drill processing step (front surface) by a grinding drill 44 and a wet drill processing step (rear surface) S112 by the grinding drill 44.SELECTED DRAWING: Figure 5

Inventors:
MIYAGISHI YOSHIYUKI
KOSEKI RYOJI
Application Number:
JP2018058672A
Publication Date:
October 03, 2019
Filing Date:
March 26, 2018
Export Citation:
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Assignee:
MICRO PROCESS CORP
International Classes:
B24B5/48; B23K26/382; B23P23/04; B24B1/00
Attorney, Agent or Firm:
横井 敏弘