Title:
PRODUCTION OF BLISTER PACKAGE AND CASE THEREOF
Document Type and Number:
Japanese Patent JP3270919
Kind Code:
B2
Abstract:
PURPOSE: To readily and securely fix a decoration plate without tape fixation, by forming a fixing flap for a decoration plate set in the inside of a recess, between the flat peripheral edge of a case and the side face of the recess partitioning a containing space of commodities.
CONSTITUTION: A blister package is used for sale of accessories or the like of electronic devices for instance. A space 11 made by a recess is formed in a transparent resin case 10. A decoration plate 28 is set in the inside and comodities are arranged at the front or the upper part thereof. And a base board is superposed at the rear side of case 10 to heat-seal respective peripheries. The whole body is suspended at a hanging hole 23 to display it. In this production case of the blister package, the outline and the hanging hole of the case are punched out by a trimming die and at the same time, a notch is made in the case by the blade of trimming die. In this way, a fixing flap 24 of the decoration plate 28 is formed on the continuous slope 13 in the periphery 12 of case 10.
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Inventors:
Eiko Yamada
Application Number:
JP14705794A
Publication Date:
April 02, 2002
Filing Date:
June 06, 1994
Export Citation:
Assignee:
ソニー株式会社
International Classes:
B65D75/36; B29D22/00; (IPC1-7): B65D75/36; B29D22/00
Domestic Patent References:
| JP5999969U | ||||
| JP55166765U | ||||
| JP60150984U |
Attorney, Agent or Firm:
Osamu Matsumura
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