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Patent Searching and Data


Title:
PRODUCTION OF CHIP TYPE THIN FILM TERMISTOR ELEMENT
Document Type and Number:
Japanese Patent JPH0955304
Kind Code:
A
Abstract:

To produce the end face electrode efficiently in the dicing process by forming a stripe pattern of protective layer continuously between adjacent elements in Y direction and forming thin film patterns of end face electrode on the opposite sides while separating from each other.

An epoxy based thermosetting resin is screen printed and thermally set to form a pattern of protective layer, i.e., an insulating heat resistant resin layer, on a silicon oxide layer. A substrate 31 is set on an adhesive tape and cut sequentially into sticks. A plurality of sticks 32 are then arranged and stacked in Z direction. The stack 33 is mounted on a rotary drum in order to perform sputtering from the positive direction of X. Upon finishing the sputtering, a stripe pattern of protective layer continuous between adjacent elements in Y direction is formed on the stack 33 and thin film patterns 23 of end face electrode are formed on the opposite sides while being separated from each other. This method can produce a thermistor element having end face electrodes efficiently.


Inventors:
YABUSAKI MOTOHIRO
KIKUJI KUNIO
TOMONARI KENJI
Application Number:
JP1995000226055
Publication Date:
February 25, 1997
Filing Date:
August 11, 1995
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO
International Classes:
H01C17/06; H01C7/04; H01C17/12; (IPC1-7): H01C7/04; H01C17/06; H01C17/12
Attorney, Agent or Firm:
伊東 辰雄 (外1名)