PRODUCTION METHOD OF EPOXY RESIN COMPOSITION

Japanese Patent JP2015083704

A

PROBLEM TO BE SOLVED: To provide a production method of an epoxy resin composition giving a cured product excellent in fire retardancy, moisture resistance, low elasticity and the like and being suitable for application to encapsulation of electronic parts, circuit board materials and the like.SOLUTION: In a production method of an epoxy resin composition comprising an epoxy resin and a curing agent, a polyvalent hydroxy resin represented by the general formula (1) is an essential component as some or all of the curing agent. The polyvalent hydroxy resin is obtained by addition reaction of 0.1 to 1.0 mole of a styrene relative to 1 mole of the hydroxy group of a polyvalent hydroxy compound in the presence of 10 to 400 wtppm of an acid catalyst at a reaction temperature of 40 to 120°C to substitute the benzene ring of the polyvalent hydroxy compound with the styrene. A monovalent hydroxy compound generated from side reaction in this addition reaction has an area% of 3% or less when detected with gel permeation chromatography (GPC; RI).

JPH0570587	THERMOPLASTIC POLYETHER
JP6291729	Curing accelerator for epoxy resin, epoxy resin composition and electronic component equipment

YAMADA HISAFUMI
OMURA MASAMI
AOYAGI EIJIRO
NAKAHARA KAZUHIKO
KAJI MASASHI

JP2015019537A

April 30, 2015

February 03, 2015

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NIPPON STEEL & SUMIKIN CHEM CO

C08G59/62; C08G8/30

JPS4711830B
JPH08165328A	1996-06-25
JPS4852895A	1973-07-25
JPH05132544A	1993-05-28
JPH05295061A	1993-11-09
JP2010235819A	2010-10-21
JPS6317926A	1988-01-25
JPS4711830B
JPH08165328A	1996-06-25
JPS4852895A	1973-07-25
JPH05132544A	1993-05-28
JPH05295061A	1993-11-09
JP2010235819A	2010-10-21
JPS6317926A	1988-01-25

Kazuya Sasaki
Eiichi Sano
Katsumi Hara
Katsuo Naruse
Tomohiro Nakamura

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