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Title:
PROTECTION DEVICE FOR LOAD CIRCUIT
Document Type and Number:
Japanese Patent JP2009303394
Kind Code:
A
Abstract:

To provide a load circuit protection device capable of protecting a load circuit simulating a fuse.

An artificial thermal capacity Cth*, which is smaller than the thermal capacity of a wire used in the load circuit is set to calculate the temperature of the wire using a wire heat generation capacity calculation equation; a wire heat dissipation capacity calculation equation, the time measured by a timer; and the artificial thermal capacity Cth*. Then, when the calculated wire temperature reaches the tolerance temperature of the wire, a semiconductor relay S1 is cut off to protect the load circuit from generation of heat.


Inventors:
MARUYAMA AKINORI
NAKAMURA YOSHIHIDE
UEDA KEISUKE
Application Number:
JP2008155437A
Publication Date:
December 24, 2009
Filing Date:
June 13, 2008
Export Citation:
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Assignee:
YAZAKI CORP
International Classes:
H02H6/00
Domestic Patent References:
JPH06289943A1994-10-18
JP2009130944A2009-06-11
JP2002084654A2002-03-22
JPH10285784A1998-10-23
JPH07222345A1995-08-18
JP2007295776A2007-11-08
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Kawamata Sumio
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu