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Title:
PROTECTIVE FILM-FORMING FILM, PROTECTIVE FILM-FORMING COMPOSITE SHEET, PROTECTIVE FILM-EQUIPPED SEMICONDUCTOR CHIP, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2023141696
Kind Code:
A
Abstract:
To provide a protective film-forming film which can form a protective film having excellent flame retardancy and has excellent flexibility before curing, and to provide a protective film-forming composite sheet, a protective film-equipped semiconductor chip, and a semiconductor device using the protective film-forming film.SOLUTION: The protective film-forming film is formed using a resin composition containing (A) a thermoplastic resin, (B) an epoxy resin, (C) an inorganic filler, and (D) a nitrogen atom-containing compound containing no phosphorus atom. The content of the nitrogen atom-containing compound (D) containing no phosphorus atom in the resin composition is 5.5-10 mass% based on the solid content (100 mass%) of the resin composition. The protective film-forming composite sheet, the protective film-equipped semiconductor chip, and the semiconductor device use the protective film-forming film.SELECTED DRAWING: Figure 1

Inventors:
UEMURA KAZUE
WATANABE YASUTAKA
Application Number:
JP2022048151A
Publication Date:
October 05, 2023
Filing Date:
March 24, 2022
Export Citation:
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Assignee:
LINTEC CORP
International Classes:
C08G59/40; C08J5/18; C09J7/38; H01L21/301; H01L23/29
Attorney, Agent or Firm:
Patent Attorney Corporation Otani Patent Office



 
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