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Title:
PROTECTIVE FILM FORMING SHEET FOR CHIP, AND METHOD OF FABRICATING SEMICONDUCTOR CHIP
Document Type and Number:
Japanese Patent JP3544362
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a protective film forming sheet for chip, which allows easier formation of a highly uniform protective film at the rear surface of chip and can eliminate adverse effects resulting from damages, even if fine damages are formed on the rear surface of chip through mechanical cutting process.
SOLUTION: This protective film forming sheet for chip includes a peeling sheet and a protective film forming layer, which is composed of a thermal or energy setting element formed on the peeling surface of the peeling sheet and a binder polymer element.


Inventors:
Hideo Seno
Takashi Sugino
Osamu Yamazaki
Application Number:
JP2001000081226
Publication Date:
July 21, 2004
Filing Date:
March 21, 2001
Export Citation:
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Assignee:
Lintec Corporation
International Classes:
C09J7/00; C09J133/00; C09J163/00; H01L21/301; H01L21/58; H01L21/68; H01L21/78; H01L23/00; H01L23/31; H01L23/48; (IPC1-7): H01L21/301; C09J7/00
Domestic Patent References:
JP8053655A
JP11283939A
Attorney, Agent or Firm:
Shunichiro Suzuki