RADICAL CURABLE COMPOSITION FOR WAFER LEVEL LENS

Title:

RADICAL CURABLE COMPOSITION FOR WAFER LEVEL LENS

Document Type and Number:

Japanese Patent JP2013049823

Kind Code:

A

Abstract:

To provide a radical curable composition for a wafer level lens which is excellent in optical characteristics and can form a cured article having extremely excellent form retention properties even under a high temperature environment.

The radical curable composition for the wafer level lens includes the following radical curable compound (A) as a radical curable compound. The radical curable compound (A) is a compound expressed by formula (1). (In the formula, R¹ is a single bond, a methylene group in which one or two of hydrogen atoms may be substituted by a 1-5C alkyl group, a sulfonyl group, a sulfur atom or an oxygen atom; R² and R³ are the same or different, and express each a hydrogen atom or a methyl group; X and X' are the same or different, and express each a sulfur atom or an oxygen atom; R and R' are the same or different, and express each a 1-5C alkyl group; and n and n' are the same or different, and express each 0 or 1).

Inventors:

KUBO TAKASHI
FUJIKAWA TAKESHI
KISHIMOTO MAKI

Application Number:

JP2011209262A

Publication Date:

March 14, 2013

Filing Date:

September 26, 2011

Export Citation:

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Assignee:

DAICEL CORP

International Classes:

C08F20/10; C08F2/44; G02B1/04; G02B3/00

Domestic Patent References:

JPH04239539A	1992-08-27
JPH0551412A	1993-03-02
JPH05105772A	1993-04-27
JPH05142501A	1993-06-11
JPH08113614A	1996-05-07
JP2000136220A	2000-05-16
JP2001305305A	2001-10-31
JP2010224118A	2010-10-07
JPH072939A	1995-01-06
JP2003329801A	2003-11-19
JPH05303003A	1993-11-16
JPH09316129A	1997-12-09

Attorney, Agent or Firm:

後藤幸久
羽明由木

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