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Title:
RADICAL CURABLE COMPOSITION FOR WAFER LEVEL LENS
Document Type and Number:
Japanese Patent JP2013049823
Kind Code:
A
Abstract:

To provide a radical curable composition for a wafer level lens which is excellent in optical characteristics and can form a cured article having extremely excellent form retention properties even under a high temperature environment.

The radical curable composition for the wafer level lens includes the following radical curable compound (A) as a radical curable compound. The radical curable compound (A) is a compound expressed by formula (1). (In the formula, R1 is a single bond, a methylene group in which one or two of hydrogen atoms may be substituted by a 1-5C alkyl group, a sulfonyl group, a sulfur atom or an oxygen atom; R2 and R3 are the same or different, and express each a hydrogen atom or a methyl group; X and X' are the same or different, and express each a sulfur atom or an oxygen atom; R and R' are the same or different, and express each a 1-5C alkyl group; and n and n' are the same or different, and express each 0 or 1).


Inventors:
KUBO TAKASHI
FUJIKAWA TAKESHI
KISHIMOTO MAKI
Application Number:
JP2011209262A
Publication Date:
March 14, 2013
Filing Date:
September 26, 2011
Export Citation:
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Assignee:
DAICEL CORP
International Classes:
C08F20/10; C08F2/44; G02B1/04; G02B3/00
Domestic Patent References:
JPH04239539A1992-08-27
JPH0551412A1993-03-02
JPH05105772A1993-04-27
JPH05142501A1993-06-11
JPH08113614A1996-05-07
JP2000136220A2000-05-16
JP2001305305A2001-10-31
JP2010224118A2010-10-07
JPH072939A1995-01-06
JP2003329801A2003-11-19
JPH05303003A1993-11-16
JPH09316129A1997-12-09
Attorney, Agent or Firm:
後藤 幸久
羽明 由木