Title:
REACTIVE ION PLATING APPARATUS
Document Type and Number:
Japanese Patent JPS58118119
Kind Code:
A
Abstract:
PURPOSE:To improve a film in reproducibility and uniformity, by providing in a vacuum chamber a reaction tube having an inlet for forcing the direction of flows of a reaction gas and a vaporized mateial toward a substrate holder. CONSTITUTION:Inside a vacuum chamber 31, an evaporation source 32 and an ionizer 33 are disposed in the upward order and surrounded with a cylinder 30, to which a gas inlet pipe 35 is connected. By this constitution, the flow of a reaction gas 37 constituted by N2 introduced through the pipe 35 and Ti from the source 32 is forced toward a substrate holder 34, and the reaction gas 37 having passed through the ionizer 33 is constantly fresh. If a reactive ion plating is carried out by employing this constitution, TiN having an excellent film quality, without any fogging, can be uniformly obtained over the whole surface of a substrate. The reproducibility is also excellent.
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Inventors:
NOGUCHI KESAO
Application Number:
JP131882A
Publication Date:
July 14, 1983
Filing Date:
January 07, 1982
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/31; C23C14/00; C23C14/24; H01L21/203; (IPC1-7): H01L21/205
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)