PURPOSE: To prevent a chip on cream soldering from slipping due to shaking of a board when chip mounting is ended and receiving pins descend.

CONSTITUTION: This embodiment comprises a plate 6 provided under a positioning part 3 of a board 1, receiving pins 7 which stand on the plate 6 and which supports the board 1 from below, and a cylinder device 8 for ascending and descending the plate 6, The cylinder device 8 is composed by combining a cylinder 10 for ascending and descending the plate 6 at a high speed with a cylinder 11 for ascending and descending the plate 6 at a low speed. When the receiving pins 7 are descended to release a supporting condition of the board 1, the receiving pins 7 are descended slowly by the cylinder 11 for ascending and descending at a low speed, whereby a chip P can be prevented from slipping by shaking the board 1 at releasing of the supporting condition.