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Title:
RECYCLING METHOD OF POLISHING SLURRY
Document Type and Number:
Japanese Patent JP2009054629
Kind Code:
A
Abstract:

To provide a recycling method of polishing slurry capable of recycling used slurry used in a semiconductor wafer polishing process, in particular, a final polishing process, and of reducing manufacturing cost of a semiconductor wafer by remarkably reducing slurry usage.

This recycling method of polishing slurry used for recycling used slurry prepared by including colloidal silica, and used in the polishing process of a semiconductor wafer is characterized by executing: a process S7 of adding a dispersant in recovered used slurry to prevent gelation of the used slurry; a process S8 of irradiating the used slurry with the dispersant added therein with ultrasonic waves to disperse the gelated slurry and aggregated silica; and a process S9 of removing a foreign substance in the used slurry after ultrasonic wave irradiation by a filter.


Inventors:
KOSASA KAZUAKI
GOTO ISAMU
Application Number:
JP2007217118A
Publication Date:
March 12, 2009
Filing Date:
August 23, 2007
Export Citation:
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Assignee:
SUMCO TECHXIV CORP
International Classes:
H01L21/304; B24B57/02
Domestic Patent References:
JP2006086144A2006-03-30
JP2000308967A2000-11-07
JPH09102475A1997-04-15
JP2002075929A2002-03-15
JP2006086144A2006-03-30
JP2004063858A2004-02-26
Attorney, Agent or Firm:
特許業務法人樹之下知的財産事務所