Title:
REDUCTION TREATMENT METHOD
Document Type and Number:
Japanese Patent JP2017082332
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a flexible substrate processing apparatus which allows the stable reduction treatment of an oxide contained in a film-like structure body formed on a flexible substrate.SOLUTION: The apparatus is a device configuration which includes a substrate carrying-out portion where a flexible substrate on which a film-like structure body is formed is delivered; a reduction portion where an oxide contained in the film-like structure body formed on the flexible substrate is electrochemically reduced; a washing portion where the flexible substrate and the film-like structure body are washed; a drying portion where the flexible substrate and the film-like structure body are dried; and a substrate carrying-in portion where the flexible substrate on which the film-like structure body is formed is taken up.SELECTED DRAWING: Figure 1
Inventors:
TAKAHASHI MINORU
YONEDA YUMIKO
MOMO JUNPEI
MORIWAKA YOSHIE
KUSUMOTO NAOTO
YONEDA YUMIKO
MOMO JUNPEI
MORIWAKA YOSHIE
KUSUMOTO NAOTO
Application Number:
JP2016223237A
Publication Date:
May 18, 2017
Filing Date:
November 16, 2016
Export Citation:
Assignee:
SEMICONDUCTOR ENERGY LAB CO LTD
International Classes:
C01B32/15; C01B32/18; C01B32/182; C23C26/00; C25B3/25; H01G11/36
Domestic Patent References:
| JP2003231990A | 2003-08-19 | |||
| JP2003176116A | 2003-06-24 | |||
| JP2005350749A | 2005-12-22 | |||
| JPH0533195A | 1993-02-09 | |||
| JP2011021216A | 2011-02-03 | |||
| JP2003193293A | 2003-07-09 | |||
| JP2002033572A | 2002-01-31 | |||
| JP2011168449A | 2011-09-01 |
Foreign References:
| WO2011074125A1 | 2011-06-23 | |||
| US20100303706A1 | 2010-12-02 |
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