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Patent Searching and Data


Title:
REPAIRING METHOD OF REACTION INJECTION-MOLDED OBJECT
Document Type and Number:
Japanese Patent JP2001030363
Kind Code:
A
Abstract:

To shorten the time required in repairing, in repairing a thin-walled part or void generation part of a reaction injection-molded object, by filling a part to be repaired with a photosetting adhesive to cure the adhesive with the irradiation with light and finishing the cured adhesive into a predetermined shape.

The void generation part or thin-walled part of a reaction injection-molded object 1 being an RIM(reaction injection molding method) molded article comprising a dicyclopentadiene resin is set to a part 2 to be repaired and, in order to improve the adhesiveness of an adhesive to the part 2 to be repaired, the surface of the part 2 to be repaired is treated with sand paper to be roughened. Next, the part 2 to be repaired is filled with a photosetting adhesive 3 so as to become a built-up state, the photosetting adhesive 3 is irradiated with curing light from a light irradiation device using a high pressure mercury lamp or a metal halide type high pressure mercury lamp to be cured and finished into a predetermined shape, and a necessary coating 5 is applied to the whole of the molded object 1 to complete a reaction injection- molded product.


Inventors:
MATSUZAKI KAZUO
Application Number:
JP1999000212214
Publication Date:
February 06, 2001
Filing Date:
July 27, 1999
Export Citation:
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Assignee:
ACHILLES CORP
International Classes:
B29C71/04; B29C45/00; B29C73/02; (IPC1-7): B29C73/02; B29C45/00; B29C71/04
Attorney, Agent or Firm:
原田 卓治 (外1名)