Title:
RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2021123652
Kind Code:
A
Abstract:
To provide a resin composition which suppresses occurrence of defects in other film composed of other composition when the other film is formed on a film composed of the resin composition, a cured film obtained by curing the resin composition, a laminate containing the cured film, a method for producing the cured film, and a semiconductor device including the cured film or the laminate.SOLUTION: There are provided a resin composition which contains at least one resin selected from the group consisting of polyimide, a polyimide precursor, polybenzoxazole and a polybenzoxazole precursor, and a surface active agent satisfying at least one of the following condition 1 and condition 2; a cured film obtained by curing the resin composition; a laminate containing the cured film; and a method for producing the cured film; and a semiconductor device including the cured film or the laminate. Condition 1: Molecular weight of 500 or less. Condition 2: It can be decomposed by heating at 250°C.SELECTED DRAWING: None
Inventors:
ENOMOTO YUICHIRO
YAMAZAKI KENTA
YAMAZAKI KENTA
Application Number:
JP2020017972A
Publication Date:
August 30, 2021
Filing Date:
February 05, 2020
Export Citation:
Assignee:
FUJIFILM CORP
International Classes:
C08L79/08; C08G73/10; C08L79/04; G03F7/004; G03F7/027; G03F7/039; G03F7/32; G03F7/40; H01L21/768; H01L23/532
Attorney, Agent or Firm:
Patent Service Corporation Patent Office Sykes