RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING PATTERNED CURED FILM, SEMICONDUCTOR ELEMENT AND ELECTRONIC DEVICE

Title:

RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING PATTERNED CURED FILM, SEMICONDUCTOR ELEMENT AND ELECTRONIC DEVICE

Document Type and Number:

Japanese Patent JP2019210399

Kind Code:

A

Abstract:

To provide a resin composition that can form a cured film that has excellent storage stability at room temperature and excellent adhesion to copper.SOLUTION: A resin composition contains (A) an alkali-soluble resin, (B) a compound having two or more hydrazide groups, and (C) a heat crosslinker.SELECTED DRAWING: None

More Like This:

WO/2021/039205	COMPOSITION, FILM, NEAR-INFRARED CUT-OFF FILTER, PATTERN FORMATION METHOD, LAMINATE, SOLID-STATE IMAGING ELEMENT, INFRARED SENSOR, IMAGE DISPLAY DEVICE, CAMERA MODULE AND COMPOUND
JP7243067	tire
JP4833416	Curable composition, manufacturing method, molding method, and cured product

Inventors:

AOKI MASARU
HAMANO YOSHIMI
HASHIMOTO MASAHIRO

Application Number:

JP2018108689A

Publication Date:

December 12, 2019

Filing Date:

June 06, 2018

Export Citation:

Click for automatic bibliography generation Help

Assignee:

HITACHI CHEMICAL CO LTD

International Classes:

C08L101/02; C08F8/12; C08F220/34; C08K5/06; C08K5/25; C08K5/28; C08L33/06; G03F7/004; G03F7/023; G03F7/075; G03F7/20

Attorney, Agent or Firm:

Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano

Previous Patent: トレッド用ゴム組成物及び空気入りタイヤ

Next Patent: 接着剤組成物、接続構造体及びその製造方法