Title:
RESIN COMPOSITION FOR GAS- AND LIQUID-BARRIER MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP2001131406
Kind Code:
A
Abstract:
To provide a resin composition for a gas- and/or liquid-barrier molded product which has an excellent gas- and/or liquid-barrier property and an improved vibration property and creep resistance and is suitable for automobiles, and a molded product.
A resin composition for a gas- and/or liquid-barrier molded product is prepared by compounding from 0.5 to 100 pts.wt. liquid crystal resin (b) having a melting point of from 285 to 340°C with 100 pts.wt. polyamide resin (a).
Inventors:
TACHIKAWA KOJI
UMETSU HIDEYUKI
SATO DAISUKE
UMETSU HIDEYUKI
SATO DAISUKE
Application Number:
JP31172799A
Publication Date:
May 15, 2001
Filing Date:
November 01, 1999
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08J5/00; C08G63/60; C08L67/00; C08L71/12; C08L77/00; C08L101/12; (IPC1-7): C08L77/00; C08G63/60; C08J5/00; C08L71/12