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Patent Searching and Data


Title:
RESIN COMPOSITION AND LASER MARKING THEREOF
Document Type and Number:
Japanese Patent JPS60202119
Kind Code:
A
Abstract:

PURPOSE: A resin composition which, when laser-marked, can give clear, legible, marked characters, prepared by adding a specified amount of carbon black to a specified resin composition.

CONSTITUTION: A resin composition prepared by adding 0.5% or above carbon black to a principal component comprising 10W20wt% novolak epoxy resin, 10W 20% phenol novolak resin or cresol novolak resin and 60W80wt% inorganic filler. The marking of a resin-sealed semiconductor device has been conducted by using a thermosetting ink and, therefore, there has been a problem that the marked characters are thinned down by rubbing in the subsequent steps or during handling in packaging or by swelling during solvent washing. Although laser marking is effective in respect of resistance to detachment of marked characters and the index-up of a marking step, it is not yet put into actual use because the marked characters are not legible. By using the resin composition containing carbon black in an amount increased within the scope not detrimental to the function as an electrical insulating material, clear and legible marked characters can be obtained.


Inventors:
NARITA HIROSHI
Application Number:
JP5792084A
Publication Date:
October 12, 1985
Filing Date:
March 26, 1984
Export Citation:
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Assignee:
NIPPON ELECTRIC CO
International Classes:
C08K3/04; C08G59/00; C08G59/62; C08L61/00; C08L61/04; C08L61/06; C08L63/00; H01L23/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/62; C08K3/04; C08L61/06; C08L63/00; H01L23/00; H01L23/30