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Title:
RESIN COMPOSITION, RESIN LAYER AND CARRIER MATERIAL WITH RESIN LAYER, AND CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2011184695
Kind Code:
A
Abstract:

To provide a resin composition with an excellent dielectric property, a dimensional stability and a mounting reliability, a resin layer and a carrier material with the resin layer, and a circuit board.

The resin composition includes (A) a cyclic olefin resin and (B) one or a plurality combinations of a porous inorganic filler, an inorganic hollow filler, polytetrafluoroethylene (PTFE) particles, wherein the cyclic olefin resin preferably includes a polynorbornene resin.


Inventors:
ITO TEPPEI
DAITO NORIYUKI
Application Number:
JP2011000092041
Publication Date:
September 22, 2011
Filing Date:
April 18, 2011
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L45/00; C08K3/36; C08K7/24; C08L27/18; H05K1/03
Domestic Patent References:
JP2004169049A2004-06-17
JPH11162551A1999-06-18
JP2002088120A2002-03-27
JP2002344100A2002-11-29
JP3317702B22002-08-26
Foreign References:
WO1998056011A11998-12-10
Attorney, Agent or Firm:
速水 進治