Title:
RESIN COMPOSITION, PREPREG, AND PRINTED WIRING BOARD THEREWITH
Document Type and Number:
Japanese Patent JP3946626
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition, a prepreg, and a printed wiring board excellent in heat resistance, low in thermal expansion, and excellent in flame-retardant property.
SOLUTION: This resin composition contains as essential components, a cyanate resin and/or its prepolymer, an epoxy resin, a benzoxazine resin, and an inorganic filler. This prepreg is prepared by impregnating the resin composition to a base material. This printed wiring board is manufactured by laminating the prepreg and by heat/pressure molding.
Inventors:
Arai Masataka
August Sakuhi Takeshi
Takayuki Mahou
Tatsuhiro Yoshida
August Sakuhi Takeshi
Takayuki Mahou
Tatsuhiro Yoshida
Application Number:
JP2002351160A
Publication Date:
July 18, 2007
Filing Date:
December 03, 2002
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08J5/24; C08L63/00; C08G59/40; C08K3/00; C08L79/00; C08L79/04; H05K1/03; (IPC1-7): C08L63/00; C08G59/40; C08J5/24; C08K3/00; C08L79/00; C08L79/04; H05K1/03
Domestic Patent References:
| JP2003020410A | ||||
| JP2001122949A | ||||
| JP2002265754A | ||||
| JP2002194119A |
Foreign References:
| WO2002055603A1 |