RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, PREPREG AND LAMINATE

Title:

RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, PREPREG AND LAMINATE

Document Type and Number:

Japanese Patent JP2013035960

Kind Code:

A

Abstract:

To provide a resin composition for printed circuit boards, excellent in adhesiveness to conductive layers formed by plating in spite of small surface unevennesses, heat resistance, moisture heat resistance and combustion resistance, and suitable for forming fine circuits.

The resin composition includes an aralkyl type epoxy resin (A), an aralkyl type phenolic resin (B), boehmite (C), silicone powder (D) and polyvinyl acetal (E).

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Inventors:

OMORI TAKAFUMI
HASEBE KEIICHI
YOTSUYA SEIJI

Application Number:

JP2011174071A

Publication Date:

February 21, 2013

Filing Date:

August 09, 2011

Export Citation:

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Assignee:

MITSUBISHI GAS CHEMICAL CO

International Classes:

C08L63/00; C08G59/62; C08J5/24; C08K3/22; C08K3/36; C08K5/3415; C08L29/14; H05K1/03; H05K3/46

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