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Patent Searching and Data


Title:
RESIN COMPOSITION, PROCESS FOR PRODUCING RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATE BOARD AND PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2011074124
Kind Code:
A
Abstract:

To provide a resin composition having low viscosity when formed into a varnish while maintaining excellent dielectric characteristics of PPE, and excellent in heat resistance of resultant cured products.

The resin composition includes (A) a reaction product containing a low molecular weight polyphenylene ether having a ratio of a weight average molecular weight to a number average molecular weight, which is 500-3,000, of 1-3, and an epoxy resin, and obtained by preliminarily reacting at least part of hydroxyl groups of the low molecular weight polyphenylene ether with epoxy groups of the epoxy resin, (B) a cyanate resin having two more cyanate groups in average in one molecule, and (C) a curing accelerator. The epoxy resin includes a first epoxy resin having a number average molecular weight of ≤600 and having 1.5 to 2.4 epoxy groups in average in one molecule and a second epoxy resin having a number average molecular weight of ≤1,000 and having 2.5 to 4.4 epoxy groups in average in one molecule.


Inventors:
FUJIWARA HIROAKI
YAMAGUCHI MANA
SAITO HIRONORI
Application Number:
JP2009000224416
Publication Date:
April 14, 2011
Filing Date:
September 29, 2009
Export Citation:
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Assignee:
PANASONIC ELEC WORKS CO LTD
International Classes:
C08G59/14; B32B15/08; C08G59/62; C08G65/40; C08G73/00; C08J5/24; H05K1/03
Attorney, Agent or Firm:
小谷 悦司