Title:
樹脂組成物、熱硬化性フィルム、硬化物、プリント配線板、半導体装置
Document Type and Number:
Japanese Patent JP6857895
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition that achieves both lowered CTEs and the thinning of a resin film.MEANS FOR SOLVING THE PROBLEM: A resin composition has a styrenic thermoplastic elastomer, a thermosetting resin, and an inorganic filler. The content of the thermoplastic elastomer is 60-85 wt.% relative to the all resin components; and the inorganic filler has a maximum particle size of 5 μm and its content is 54-85 wt.% relative to the all components.SELECTED DRAWING: None
Inventors:
Toshio Kondo
Munetoshi Hima
Satoko Takahashi
Masaki Yoshida
Munetoshi Hima
Satoko Takahashi
Masaki Yoshida
Application Number:
JP2017042147A
Publication Date:
April 14, 2021
Filing Date:
March 06, 2017
Export Citation:
Assignee:
Namics Co., Ltd.
International Classes:
C08L53/02; C08J5/18; C08K3/013; C08L63/00; H05K1/03
Domestic Patent References:
| JP2016190966A | ||||
| JP201574712A | ||||
| JP201490135A | ||||
| JP2011190339A | ||||
| JP2015137287A |
Foreign References:
| WO2016175326A1 |
Attorney, Agent or Firm:
Isshiki International Patent Service Corporation