Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2023024329
Kind Code:
A
Abstract:
To provide a resin composition containing a polyphenylene sulfide resin excellent in low warpage and heat resistance.SOLUTION: There is provided a resin composition which contains 25 to 48 pts.mass of a polyphenylene sulfide resin (A) having an MVR of 60 to 500 cm3/10 min, as measured at 295°C under a load of 1.00 kgf, an amorphous rubber-reinforced polystyrene or a polystyrene (B) having an MVR of 0.3 to 16 cm3/10 min, as measured at 200°C under a load of 5 kgf and/or a polyphenylene ether resin (C), based on 100 pts.mass of the total of (A) to (C), wherein the total content of the (B) and (C) is 52 to 75 pts.mass and the resin composition contains 5 to 150 pts.mass of a fibrous filler.SELECTED DRAWING: Figure 1

Inventors:
MUTO FUMIHIRO
Application Number:
JP2022119538A
Publication Date:
February 16, 2023
Filing Date:
July 27, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI ENG PLASTICS CORP
International Classes:
C08L81/02; C08K7/02; C08L25/06; C08L51/04; C08L71/12
Attorney, Agent or Firm:
Naozumi Ono
Okunuki Sachiko