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Patent Searching and Data


Title:
RESIN FORMING MOLD DEVICE, MOLDING METHOD, AND MOLDING
Document Type and Number:
Japanese Patent JPH0976301
Kind Code:
A
Abstract:

To restrain generation of sink marks without increasing a thickness of a base plate for the reason that a sink mark generates on a rear face of a boss resulting in damage of its appearance when the thickness of the boss exceeds 2/3 of the thickness of the base plate for improving the screwing strength of the boss.

A mold 1a for forming a face A, a mold 1b for forming a face B and a boss, and a pin 5 for forming a center hole of the boss are provided. There are also provided a boss-like movable mold 6 which fits in the outer peripheral face of the pin 5 for forming the center hole of the boss and an inner peripheral face of a cavity 3 of the boss, and a stopper 8 which temporarily interrupts the backing of the movable mold 6 due to injection pressure. Until a skin layer having a predetermined thickness is formed at a position 3a corresponding to a boss on the face A, the boss-like movable mold 6 is held by the holding of the stopper 8. After the skin layer is formed, the stopper 8 is released so as to make the boss-like movable mold 6 back by injection pressure.


Inventors:
YOSHIDA HIROMITSU
MASUDA SEIJI
Application Number:
JP26107095A
Publication Date:
March 25, 1997
Filing Date:
September 14, 1995
Export Citation:
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Assignee:
MITSUBISHI RAYON CO
International Classes:
B29C33/76; B29C45/26; B29C45/56; B29D22/00; B29C45/00; (IPC1-7): B29C45/26; B29C33/76; B29C45/56; B29D22/00
Attorney, Agent or Firm:
Toshio Yoshizawa