Title:
RESIN MOLDING METHOD AND APPARATUS FOR ELECTRONIC PART
Document Type and Number:
Japanese Patent JP2003209130
Kind Code:
A
Abstract:
To improve the productivity of an article 19 by effectively producing the article 19.
In a resin molding apparatus 1, a set of mold units 10 are constructed with a mold mechanism 4 including a resin sealing mold 3, a material aligning mechanism 7 for aligning a lead frame 5 supplied to the mold 3 and a resin tablet 6, and a molded article accommodating mechanism 9 for accommodating a molded article 8 molded in the mold 3, and a plurality of sets of the mold units 10 are provided. Further, there is provided a conveyance unit 23 serving also for each mold unit for conveying the lead frame 5, the resin tablet 6, and the molded article 8, and the mold units 10 are exchanged and provided independently in a short time.
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Inventors:
HORIUCHI KAZUO
Application Number:
JP2002008646A
Publication Date:
July 25, 2003
Filing Date:
January 17, 2002
Export Citation:
Assignee:
TOWA CORP
International Classes:
B29C45/14; B29C45/17; H01L21/56; B29L31/34; (IPC1-7): H01L21/56; B29C45/14; B29C45/17