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Patent Searching and Data


Title:
RESIN MOLDING WITH COVERING LAYER AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH11157014
Kind Code:
A
Abstract:

To obtain a resin molding having a covering layer excellent in wear resistance, weatherability and adhesion.

On the surface of a resin molding, a layer made of an acrylic crosslinked polymer, which has at least one SiO bond and includes 2 wt.% or less of Si atom is provided. Further, on the above-mentioned acrylic crosslinked polymer, a layer made of an acrylic crosslinked polymer, which has at least one SiO bond and includes 2-40 wt.% of Si atom is provided. A layer made of organopolysiloxane is formed on the layer just mentioned above.


Inventors:
SUGAMOTO HIDEMASA
KAWAI OSAMU
NAKAUCHI JUN
Application Number:
JP1997000343634
Publication Date:
June 15, 1999
Filing Date:
December 01, 1997
Export Citation:
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Assignee:
MITSUBISHI RAYON CO
International Classes:
C08J7/04; B32B27/00; B32B27/30; C09D133/00; C09D183/07; (IPC1-7): B32B27/00; B32B27/30; C08J7/04; C09D183/07
Attorney, Agent or Firm:
Toshio Yoshizawa