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Patent Searching and Data


Title:
RESIN SEALED STRUCTURE FOR LED
Document Type and Number:
Japanese Patent JPH0653553
Kind Code:
A
Abstract:

PURPOSE: To retard exfoliation of epoxy resin from a printed board.

CONSTITUTION: A printed board 11 is fixed to the back face side of a light reflecting case 10 having a hole 10a for fixing an LED element and 8 pair of bonding pads 12, 13 are provided on the substrate 11 in the hole 10a while a LED element 14 is fixed to the pad 12. The LED element 14 and the pad 13 are connected through a wire 15 and the hole 10a is sealed with epoxy resin 16 thus providing the pads 12, 13 with a complex pattern for increasing adhesion area between the epoxy resin 16 and an exposed face 11a of the substrate.


Inventors:
MANO YASUHISA
FUJII TAKEHIRO
Application Number:
JP20126292A
Publication Date:
February 25, 1994
Filing Date:
July 28, 1992
Export Citation:
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Assignee:
ROHM CO LTD
International Classes:
H01L21/56; H01L23/02; H01L23/28; H01L33/56; H01L33/60; (IPC1-7): H01L33/00; H01L21/56; H01L23/02; H01L23/28
Attorney, Agent or Firm:
中村 茂信