Title:
RESIN SEALED TYPE SEMICONDUCTOR DEVICE MOLD
Document Type and Number:
Japanese Patent JPH0582573
Kind Code:
A
Abstract:
PURPOSE: To prevent resin burrs from being formed at an island section connected to a heat dissipating component.
CONSTITUTION: A semiconductor element 6 is fixed to an island 9 with Ag paste 10 by bonding, the island 9 concerned is supported with a support pad 2 provide with suction hole 3 and furthermore firmly fixed by vacuum suction, a lead frame is pinched between the lower primary surface of a cope 4 and the upper primary surface of a drag 1, and all semiconductor device is sealed up with sealing resin.
Inventors:
NIWA KOICHIRO
KOBAYASHI YASUHISA
KOBAYASHI YASUHISA
Application Number:
JP23853791A
Publication Date:
April 02, 1993
Filing Date:
September 19, 1991
Export Citation:
Assignee:
NEC CORP
International Classes:
B29C45/26; H01L21/56; H01L21/68; H01L21/683; B29L31/34; (IPC1-7): B29C45/26; B29L31/34; H01L21/56; H01L21/68
Attorney, Agent or Firm:
Uchihara Shin
Next Patent: MANUFACTURE OF ULTRA-THIN TYPE SEMICONDUCTOR DEVICE