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Title:
RESIN-SEALING OF MODULE FOR NON-CONTACT IC CARD USE
Document Type and Number:
Japanese Patent JPH1027812
Kind Code:
A
Abstract:

To lessen the roughness of the surface of a thin card and to make it possible to give a superior printing efficiency to the card by a method wherein a module for non-contact IC card use is encapsulated with a crystalline thermoplastic resin, which has a prescribed crystallizing temperature and generates heat of a specified amount at the time of crystalization.

The volume change due to a temperature change of a resin having a crystallinity is large especially at a temperature at which the crystalline part of the resin is melted or is crystallized from a state that the crystallize part is melted. Accordingly, it is important to confine the volume change of a sealing resin to the minimum at a temperature region where a card is finally molded, especially in the process of a temperature drop at the time of the molding of the card, without irrespective of the kind of a base resin. On the basis of this, a crystalline thermoplastic resin, which has a crystallizing temperature of 70°C or higher and has a heat generation of 20 millijoule/mg or larger at the time of crystalization, is used as a sealing resin for a module for non- contact IC card use. Thereby, the volume change of the sealing resin is confined to the minimum and a non-contact IC card, which has a smooth surface and is good in printing finish, can be manufactured.


Inventors:
MIYOSHI MOTOYUKI
MUKAI SEIICHI
Application Number:
JP18077896A
Publication Date:
January 27, 1998
Filing Date:
July 10, 1996
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP
International Classes:
B42D15/10; G06K19/077; H01L21/56; H01L23/29; H01L23/31; (IPC1-7): H01L21/56; B42D15/10; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Hasegawa Moji