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Title:
RESIN SHEET FOR SEALING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2009188207
Kind Code:
A
Abstract:

To provide a resin sheet for sealing an optical semiconductor element which has both properties of an adhesive quality and a heat resistance, and seals efficiently, and an optical semiconductor device which seals the optical semiconductor element by use of the resin sheet.

This resin sheet for sealing the optical semiconductor element is a resin sheet for sealing the optical semiconductor element 1 composed of at least a sealing resin layer 3, a bonding resin layer 4 and a protective resin layer 2, wherein the sealing resin layer is arranged adjacent to the bonding resin layer, and the protective resin layer is laminated so as to coat both the layers directly or indirectly on the sealing resin layer and the bonding resin layer. This optical semiconductor device seals an optical semiconductor element 5 by use of the resin sheet for sealing the optical semiconductor element.


Inventors:
AKAZAWA MITSUHARU
KIMURA RYUICHI
Application Number:
JP2008026852A
Publication Date:
August 20, 2009
Filing Date:
February 06, 2008
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
H01L31/02; H01L23/28; H01L23/29; H01L23/31; H01L33/48; H01L33/54; H01L33/56
Domestic Patent References:
JP2008060166A2008-03-13
JP2006269079A2006-10-05
JP2006324623A2006-11-30
JP2006117919A2006-05-11
Attorney, Agent or Firm:
Yoshinori Hosoda