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Title:
RESIN STRUCTURE, AND VACUUM CLEANER USING THE SAME
Document Type and Number:
Japanese Patent JP2016041476
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin structure using a fiber-reinforced resin laminated sheet in a housing, which solves problems that a first layer formed of an FRP using a carbon fiber fabric or the like as a reinforcing material, and a second layer formed of a resin are easy to be delaminated, and in particular, are easy to be deformed due to a physical difference (thermal shrinkage) therebetween immediately after molding.SOLUTION: A resin molding 14 is structured of a fiber-reinforced resin laminated sheet 15 formed of a polyolefin resin, and a resin support member 16 formed of a resin having high affinity with the fiber-reinforced resin laminated sheet 15. The resin molding 14 has such a structure that at least one of a glass fiber and talc powder is mixed into the resin support member 16, and the resin support member 16 is fused to the fiber-reinforced resin laminated sheet 15 through an integral molding method including insert molding, and thereby does not cause a shape change due to thermal shrinkage immediately after insert molding, and can prevent deformation such as warpage and shrinkage on a surface which is fused to the fiber-reinforced resin laminated sheet 15.SELECTED DRAWING: Figure 4

Inventors:
KODERA SADAMOTO
MIYAHARA TOSHIFUMI
YOSHIKAWA TATSUO
NAKAMOTO HIROSHI
KIRITOOSHI TAKESHI
MINE HIDEO
OKAMOTO SHOICHI
HARADA KAZUYUKI
TANAKA MASAFUMI
Application Number:
JP2014165717A
Publication Date:
March 31, 2016
Filing Date:
August 18, 2014
Export Citation:
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Assignee:
PANASONIC IP MAN CORP
International Classes:
B32B27/32; A47L9/00; B29C45/14; B32B5/28
Domestic Patent References:
JPH079462A1995-01-13
JP2006044262A2006-02-16
Attorney, Agent or Firm:
Kentaro Fujii
Kenji Kamada
Hiroo Maeda



 
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