PURPOSE: The titled composition excellent in thermal cycling property and capable of providing a flame-retarding resin-sealed semiconductor device, prepared by mixing an epoxy resin with a specified curing agent, an organic phosphine compound and a halogen compound.
CONSTITUTION: The titled composition prepared by mixing (A) an epoxy resin (e.g., novolak epoxy resin of an equivalent weight of 170W300 with (B) a curing agent having at least two phenolic hydroxyl groups in the molecule (e.g., elastomer component-grafted novolak phenolic resin), (C) an organic phosphine compound (e.g., triphenylphosphine), and (D) a halogen compound (e.g., brominated novolak epoxy resin). In resin A containing compound C, its thermal cycling property can be markedly improved when its flame retardation is performed by using compound D alone without Sb2O3. By the co-use of curing agent B, the effect becomes marked.
HIRAI HISASHI
AZUMA MICHIYA
KIHARA NAOKO
