Title:
SEALING RESIN COMPOSITION AND MOLD COIL
Document Type and Number:
Japanese Patent JP2021015932
Kind Code:
A
Abstract:
To provide a sealing resin composition having good heat dissipation.SOLUTION: A sealing resin composition is used to seal a coil, and includes a thermosetting resin (A) and an inorganic filler (B), and the thermal conductivity calculated by the following steps is 2 W/mK or more and 50 W/mK or less. Procedure: a molded product (1.0×1.0 mm, thickness 1.0 mm) of the sealing resin composition is prepared under the condition of a mold temperature of 175°C, an injection pressure of 6.9 MPa, and a curing time of 120 seconds, and post-cured for two hours at 175°C to acquire a test piece. By using the obtained test piece, the thermal diffusivity is measured by a laser flash method, the specific gravity and specific heat are further measured, and the thermal conductivity in the thickness direction of the test piece is calculated from each of the obtained measured values.SELECTED DRAWING: Figure 1
Inventors:
HARADA TAKAHIRO
Application Number:
JP2019130997A
Publication Date:
February 12, 2021
Filing Date:
July 16, 2019
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
H01F41/12; C08K3/013; C08L63/00; C08L101/00; H01B3/40; H01F27/32; H01F37/00
Attorney, Agent or Firm:
Shinji Hayami