Title:
SEALING SHEET ATTACHMENT METHOD
Document Type and Number:
Japanese Patent JP2014215278
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To accurately attach a sealing sheet to a semiconductor element formed on a semiconductor substrate.SOLUTION: A sealing sheet formed by disposing release liners in a sealing layer is attached to a semiconductor substrate while adding heat and pressure to the sheet, to obtain a temporary crimped state. In this state, the semiconductor substrate is exposed to an X ray, to obtain a transmission image. Whether or not there are voids is inspected from the transmission image and the locations of the voids are determined; and after forming a discharge flow path by sticking a needle for each void, the discharge flow path is repaired while removing the voids by adding heat and pressure to the sealing sheet again. If voids are not detected after re-inspection, the sealing layer is hardened, to be completely crimped to the semiconductor substrate.
Inventors:
KANESHIMA YASUHARU
MORI SHINICHIRO
YAMAMOTO MASAYUKI
MORI SHINICHIRO
YAMAMOTO MASAYUKI
Application Number:
JP2013095334A
Publication Date:
November 17, 2014
Filing Date:
April 30, 2013
Export Citation:
Assignee:
NITTO DENKO CORP
NITTO SEIKI KK
NITTO SEIKI KK
International Classes:
G01N23/04
Attorney, Agent or Firm:
Tsutomu Sugitani
Hiroyuki Todaka
Tomohiko Sugitani
Kurihara Important point
Hiroyuki Todaka
Tomohiko Sugitani
Kurihara Important point
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