Title:
SEMICONDUCTOR DEVCICE
Document Type and Number:
Japanese Patent JPS5389661
Kind Code:
A
Abstract:
PURPOSE: To prevent curving and deterioration at high temperature and prolong service life by interposing an auxiliary metal plate having the same coefficient of thermal expansion as that of a cooling metal substrate between a ceramic insulation plate and a semiconductor element.
Inventors:
MATSUZAKI HITOSHI
Application Number:
JP392777A
Publication Date:
August 07, 1978
Filing Date:
January 19, 1977
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L23/34; H01L21/52; H01L21/58; H01L23/12; (IPC1-7): H01L21/58; H01L23/12; H01L23/34
Domestic Patent References:
| JPS4953771A | 1974-05-24 | |||
| JPS5132370U | 1976-03-09 | |||
| JP49070862B |